Assembly

 

 

 

Packaging

 

 

 

Bumps

 

 

COB (Chip On Board) on Flex, Kapton, FR4, Polymid, Rogers,..

COC (Chip On Chip)

SBB (Stud Ball Bumping) for Flip Chip and S.M.C

Hybrid module assembly

 

 

 

 

 

HCM.SYSTREL

La Rochelle: Tel 33 (0)5 46 45 12 70 
Les Ulis: Tel 33 (0)1 69 07 80 39 
Contact