“From diode to microprocessor”

Purchasing of wafers from semiconductor manufacturers.

Probing (option)

Sawing and loading in waffle pack

Visual inspection according to the following spec: MIL-STD 750 Method 2072/2073. MIL-STD Method 2010 Cond. A or B.

Qualification lot including environmental tests.


 


HCM.SYSTREL

La Rochelle: Tel 33 (0)5 46 45 12 70 
Les Ulis: Tel 33 (0)1 69 07 80 39 
Contact